The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Nov. 18, 2021
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Liang-Lu Chen, Miao-Li County, TW;

Kuang-Ming Fan, Miao-Li County, TW;

Chia-Lin Yang, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/6835 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); H01L 21/568 (2013.01); H01L 22/34 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/54486 (2013.01);
Abstract

A method for manufacturing a multi-layered structure on a supporting entity is provided. The method includes forming a first layer and a first test mark on the supporting entity, wherein the first test mark has a first predetermined length. The first projected length of the first test mark is measured in a top view. The first warpage degree of the first test mark is calculated according to the first predetermined length and the first projected length.


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