The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Apr. 19, 2023
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventor:
Katsuya Taniguchi, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1272 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01);
Abstract
A multilayer ceramic electronic device includes a multilayer chip. The multilayer chip has a capacity section and a side margin. The side margin includes boron and silicon, and includes a first section and a second section in order from the capacity section side toward outside. A boron concentration of the first section is larger than a boron concentration of the second section. A segregation degree of silicon in the second section is larger than a segregation degree of silicon in the first section.