The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Mar. 24, 2020
Applicant:

Koyo Giken Inc., Kanagawa, JP;

Inventors:

Kouji Kai, Kanagawa, JP;

Kazuki Houzan, Kanagawa, JP;

Tuyosi Shinozaki, Kanagawa, JP;

Mitoshi Kai, Kanagawa, JP;

Assignee:

KOYO GIKEN INC., Kanagawa, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/10 (2006.01); B23K 11/24 (2006.01); F28F 3/04 (2006.01); H01F 38/08 (2006.01);
U.S. Cl.
CPC ...
H01F 27/10 (2013.01); B23K 11/241 (2013.01); F28F 3/048 (2013.01); H01F 38/085 (2013.01);
Abstract

A flat, electrically and thermally conductive flat surface group is formed in the common connection regionof the secondary coil. The flat conductive surface group is directly and mechanically joined to the connecting surfaces of the first conductor plate, the second conductor plate, and the third conductor plate, respectively. The first conductor plate, the second conductor plate, and the third conductor platecover the entire common connection region. The annular first conductor plateoccupies the maximum area. The refrigerant can be circulated in the annular cavity provided inside the first conductor plateto efficiently cool the whole.


Find Patent Forward Citations

Loading…