The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Apr. 11, 2023
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventors:

Ahmad Abdel Rauof Samih, Austin, TX (US);

Daniel Henry Morris, Mountain View, CA (US);

Hadi Asgharimoghaddam, Kirkland, WA (US);

Pietro Caragiulo, Palo Alto, CA (US);

Vamshi Krishna Lakkaraju, Chandler, AZ (US);

Vivek Venkatesan, Pleasanton, CA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/00 (2006.01); G06F 13/16 (2006.01); G11C 29/00 (2006.01);
U.S. Cl.
CPC ...
G11C 29/83 (2013.01); G06F 13/1668 (2013.01); G11C 29/785 (2013.01);
Abstract

A headset includes a camera a 3D stacked memory configured to store image data captured by the camera, and a System-on-Chip (SoC) configured to process the image data stored in the 3D stacked memory. The 3D stacked memory includes a plurality of first drivers/receivers and a plurality of memory banks that are accessible in parallel. Each memory bank is accessible via a corresponding first driver/receiver. The SoC includes a memory controller with a plurality of second drivers/receivers. The plurality of the second drivers/receivers of the SoC are respectively connected to the plurality of the first drivers/receivers of the 3D stacked memory by a plurality of channels. The SoC and the 3D stacked memory are vertically stacked together. The plurality of the memory banks include at least eight memory banks.


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