The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Dec. 27, 2022
Applicant:

Auo Corporation, Hsin-Chu, TW;

Inventors:

Yi-Hsin Lin, Hsin-Chu, TW;

Wen-Lung Chen, Hsin-Chu, TW;

Wei-Lung Liau, Hsin-Chu, TW;

Assignee:

AUO CORPORATION, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G09F 9/302 (2006.01); G09F 9/33 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
G09F 9/3026 (2013.01); G09F 9/33 (2013.01); H01L 25/0753 (2013.01); H10H 20/853 (2025.01);
Abstract

A tiling display apparatus including a substrate, multiple display units, an adhesive layer and multiple driver chips is provided. The display units are disposed on the substrate and each has a circuit substrate, multiple light emitting devices and at least one bonding pad. The circuit substrate has a first surface and a second surface opposite to each other. The light emitting devices are disposed on the first surface. The at least one bonding pad is disposed on the second surface, and is electrically coupled to the light emitting devices. The adhesive layer connects the substrate and the display units. The substrate and the adhesive layer have a plurality of openings arranged corresponding to the openings. Multiple bonding pads of the display units are positioned in the openings. The driver chips are electrically bonded to the bonding pads of the display units through the openings.


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