The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Sep. 21, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Archanna Srinivasan, San Jose, CA (US);

Rajiv Mongia, Portland, OR (US);

Ravi Gutala, San Jose, CA (US);

Kaushik Chanda, San Jose, CA (US);

Gurvinder Tiwana, Toronto, CA;

Vadali Mahadev, San Jose, CA (US);

Mahesh A. Iyer, Fremont, CA (US);

Assignee:

Altera Corporation, San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/337 (2020.01); G06F 30/343 (2020.01); G06F 119/08 (2020.01);
U.S. Cl.
CPC ...
G06F 30/337 (2020.01); G06F 30/343 (2020.01); G06F 2119/08 (2020.01);
Abstract

Systems and methods are provided for generating a circuit design for an integrated circuit using a circuit design tool. The circuit design tool determines maximum junction temperatures for circuit blocks in the circuit design for the integrated circuit. The circuit design tool determines defects values for the circuit blocks using the maximum junction temperatures for the circuit blocks. The circuit design tool determines a defects value for the circuit design based on the defects values for the circuit blocks. The circuit design tool determines a maximum junction temperature for the circuit design based on a comparison between the defects value for the circuit design and a target defects value for the circuit design. The circuit design tool can dynamically reconfigure configurable logic circuit blocks to improve the power, the performance, and the thermal profile to achieve an optimal junction temperature per circuit block.


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