The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Jan. 24, 2024
Qualcomm Incorporated, San Diego, CA (US);
Jessica Liu Strohmann, Cupertino, CA (US);
Shiang-Chi Lin, Taoyuan, TW;
Shaojui Li, Hsinchu, TW;
Hsiang-Chi Liu, Taoyuan, TW;
Chia-Wei Yang, Hsinchu, TW;
Jae Hyeong Seo, Pleasanton, CA (US);
Kostadin Dimitrov Djordjev, Los Gatos, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
An apparatus may include a display stack, an ultrasonic sensor stack and a high-impedance stack including one or more high-impedance layers. The ultrasonic sensor stack may include an ultrasonic transceiver layer and an ultrasonic transceiver circuitry (UTC) layer. Each of the high-impedance layers may have an acoustic impedance that is higher than an acoustic impedance of the UTC layer. The high-impedance stack and the ultrasonic sensor stack may form an acoustic resonator bounded by the UTC layer and the high-impedance stack. The acoustic resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack at a peak frequency of the ultrasonic sensor stack. The peak frequency may be a frequency used by the ultrasonic sensor stack for obtaining fingerprint images. An apparatus stack portion that includes the ultrasonic sensor stack may have a thickness corresponding to a multiple of a quarter wavelength at the peak frequency.