The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
May. 26, 2023
Applicant:
Qorvo Us, Inc., Greensboro, NC (US);
Inventors:
Mehrnaz Rouhi Youssefi, San Francisco, CA (US);
Julius Minglin Tsai, San Jose, CA (US);
Assignee:
NextInput, Inc., Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/18 (2006.01); B81B 3/00 (2006.01); G01L 1/20 (2006.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); B81B 3/0072 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/04 (2013.01);
Abstract
Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.