The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Jul. 01, 2022
Shin-etsu Polymer Co., Ltd., Tokyo, JP;
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
National University Corporation Saitama University, Saitama, JP;
Junichi Ikeno, Saitama, JP;
Yohei Yamada, Saitama, JP;
Hideki Suzuki, Saitama, JP;
Rika Matsuo, Saitama, JP;
Hitoshi Noguchi, Tokyo, JP;
Shin-Etsu Polymer Co., Ltd., Tokyo, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
National University Corporation Saitama University, Saitama, JP;
Abstract
A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unitconfigured to condense laser light B so as to face an upper surfaceof a blockof single crystal diamond, a step of forming a modified layer, which includes a processing markof graphite and a crackextending along a surface (111) around the processing mark, in a partial region of the upper surfaceof the blockalong the surface (111) of the single crystal diamond, along the surface (111) of the single crystal diamond at a predetermined depth from the upper surfaceof the blockby radiating the laser light B on the upper surfaceof the blockfrom the laser condensing unitunder predetermined conditions and condensing the laser light B inside the block, and moving the laser condensing unitand the blockin a relative manner two-dimensionally, and a step of forming a cleavage planeat the predetermined depth of the remaining region of the upper surfaceof the blockby spontaneously propagating cleavage from the modified layer