The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Oct. 19, 2022
Applicant:

Nano and Advanced Materials Institute Limited, Hong Kong, HK;

Inventors:

Yiu Sun Tam, Hong Kong, HK;

Yong Zhu, Hong Kong, HK;

Chenmin Liu, Hong Kong, HK;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01);
Abstract

A cure-on-demand adhesive kit capable of self-sustaining frontal polymerization after a heat or actinic radiation trigger for bonding two substrates is provided. The kit includes a first monomer/oligomer component and a UV or thermal cure catalyst component. In practical application, the first monomer/oligomer component and the UV or thermal cure catalyst component are mixed together to form a ready-to-use prepolymer mixture. The prepolymer mixture is applied onto the surface of a first substrate, and the first substrate is contacted with a second substrate by the mixture applied side. After giving a heat or actinic radiation trigger, a self-sustaining frontal polymerization of the mixture will be started for curing the mixture between two substrates as an adhesive to adhere the two substrates.


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