The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Jun. 22, 2021
Applicant:

Inoac Corporation, Nagoya, JP;

Inventors:

Yoshinori Sugiura, Anjo, JP;

Naoya Harata, Anjo, JP;

Tatsuhiko Yasui, Anjo, JP;

Naoyuki Tanabe, Kaizu, JP;

Assignee:

INOAC CORPORATION, Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B29C 43/18 (2006.01); B29C 70/42 (2006.01); B29K 61/04 (2006.01); B29K 61/20 (2006.01); B29K 105/00 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01); B32B 5/18 (2006.01); B32B 5/24 (2006.01); B32B 27/12 (2006.01); C08J 9/42 (2006.01);
U.S. Cl.
CPC ...
C08J 5/243 (2021.05); B29C 43/18 (2013.01); B29C 70/42 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 27/12 (2013.01); C08J 9/42 (2013.01); B29K 2061/04 (2013.01); B29K 2061/20 (2013.01); B29K 2105/0845 (2013.01); B29K 2105/251 (2013.01); B29K 2307/04 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2266/0285 (2013.01); B32B 2307/718 (2013.01); B32B 2307/72 (2013.01); B32B 2307/7376 (2023.05); C08J 2361/06 (2013.01); C08J 2375/04 (2013.01); C08J 2379/02 (2013.01);
Abstract

In a method for producing a fiber-reinforced resin molded body () by heat-compressing fiber substrates (A toD) together with a thermosetting resin () so that the thermosetting resin () is impregnated into the fiber substrates (A toD) and cured, a thermosetting resin powder (A) is disposed in contact with at least one surface of the fiber substrates (A toD), the fiber substrates (A toD) are heat-compressed together with the thermosetting resin powder (A) by a mold () so that the thermosetting resin powder (A) is melted, impregnated into the fiber substrates (A toD), and cured. Also disclosed is a fiber-reinforced resin molded body as well as a vehicle or airframe including a fiber-reinforced resin molded body.


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