The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Sep. 28, 2022
Chienfu Wrapping Materials Co. Ltd., Taichung, TW;
Hsuan-Fu Huang, Taipei, TW;
CHIENFU WRAPPING MATERIALS CO. LTD., Taichung, TW;
Abstract
A wrapping material includes a substrate and a buffer layer, wherein the substrate has a first lateral edge and a second lateral edge, and the buffer layer has a third lateral edge and a fourth lateral edge. The buffer layer is stacked on the substrate. The first lateral edge of the substrate is tightly merged with the third lateral edge of the buffer layer, and the second lateral edge of the substrate is tightly merged with the fourth lateral edge of the buffer layer. A method of making a wrapping material includes: providing a substrate; stacking a buffer layer on the substrate; using a thermal cutting tool to cut the stacked substrate and buffer layer so that the substrate and the buffer layer are tightly merged at where they are cut as being melted by heat.