The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Oct. 12, 2023
Applicant:

Darwin Precisions Corporation, Hsinchu County, TW;

Inventors:

Chia Tsun Huang, Hsinchu County, TW;

Hsuan Yao, Hsinchu County, TW;

Chun-Ling Huang, Hsinchu County, TW;

Chia-Hung Liu, Hsinchu County, TW;

Assignee:

DARWIN PRECISIONS CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); B60K 35/00 (2006.01); B60K 35/10 (2024.01); B60K 35/60 (2024.01);
U.S. Cl.
CPC ...
B60K 35/00 (2013.01); H05K 1/189 (2013.01); B60K 35/10 (2024.01); B60K 35/60 (2024.01); B60K 2360/1446 (2024.01); B60K 2360/782 (2024.01);
Abstract

A three-dimensional touch device includes a flexible circuit board structure and an in-mold formed film. The flexible circuit board structure includes a flexible circuit substrate and touch electrodes disposed on the outer surface of the flexible circuit substrate. The flexible circuit substrate includes folded lines. At least two of the folded lines are not parallel to each other. A contour of the flexible circuit structure is formed by bending the flexible circuit substrate and is suitable for having a main body portion and bending portions. The bending portions are connected to the main body portion through the folded lines. The in-mold formed film encapsulates the inner surface, the outer surface and the touch electrodes. The in-mold formed film includes an exterior film layer covering the outer surface and the touch electrodes. The contour of the flexible circuit structure approaches to a part of contour of the exterior film layer.


Find Patent Forward Citations

Loading…