The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Mar. 16, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyojin Park, Hwaseong-si, KR;

Songyun Kang, Suwon-si, KR;

Sung Yong Park, Suwon-si, KR;

Keon-Woo Kim, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/18 (2006.01); B24B 37/04 (2012.01); B24B 37/30 (2012.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 49/183 (2013.01); B24B 37/042 (2013.01); B24B 37/30 (2013.01); B24B 53/017 (2013.01);
Abstract

Disclosed is a substrate polishing method comprising placing a substrate into a substrate polishing apparatus, rotating each of the substrate and a polishing pad of the substrate polishing apparatus, allowing a bottom surface of the substrate to contact a top surface of the polishing pad, and determining whether the polishing pad would benefit from maintenance. The polishing pad includes a plurality of annular regions that are homocentric with a central point of the top surface of the polishing pad. The step of determining whether the polishing pad would benefit from maintenance includes ascertaining a state of the bottom surface of the substrate, and selecting one of the plurality of annular regions by using information about the state of the bottom surface of the substrate. The one of the plurality of annular regions would benefit from maintenance.


Find Patent Forward Citations

Park, Hyojin. (2025). Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same (U.S. Patent No. 12415248). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12415248

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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