The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Mar. 10, 2020
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Daisuke Nakamura, Ibaraki, JP;
Naoki Nagaoka, Ibaraki, JP;
Manami Kurose, Ibaraki, JP;
Taketo Ishikawa, Ibaraki, JP;
Hironobu Machinaga, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H10N 30/00 (2023.01); H10N 30/06 (2023.01); H10N 30/076 (2023.01); H10N 30/079 (2023.01); H10N 30/853 (2023.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
H10N 30/708 (2024.05); H10N 30/06 (2023.02); H10N 30/076 (2023.02); H10N 30/079 (2023.02); H10N 30/853 (2023.02); H10N 30/878 (2023.02);
Abstract
The occurrence of cracking in a functional layer is suppressed, while maintaining flexibility of a layered structure. The layered structure includes a polymer substrate, and a crystalline functional layer formed on the first surface of the substrate. The surface roughness of the first surface of the substrate is 3 nm or less in terms of arithmetic mean roughness (Ra).