The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Apr. 22, 2022
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Yuichi Hashizume, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 8/60 (2025.01); H01L 21/04 (2006.01); H10D 8/01 (2025.01); H10D 62/832 (2025.01); H10D 64/64 (2025.01);
U.S. Cl.
CPC ...
H10D 8/60 (2025.01); H01L 21/0495 (2013.01); H10D 8/051 (2025.01); H10D 62/8325 (2025.01); H10D 64/64 (2025.01);
Abstract

A silicon carbide semiconductor device is a SiC-SBD that has, in an active region, at a front surface of a semiconductor substrate containing silicon carbide, a mixture of a SBD structure having Schottky barrier junctions between a titanium film that is a lowermost layer of a front electrode and an n-type drift region, and a JBS structure having pn junction portions between p-type regions and the n-type drift region. The p-type regions form ohmic junctions with the titanium film that is the lowermost layer of the front electrode. After an ion implantation for the p-type regions, activation annealing is performed at a temperature in a range of 1700 degrees C. to 1900 degrees C. for a treatment time exceeding 20 minutes, whereby contact resistance between the titanium film and the p-type regions is adjusted to be in a range of about 5×10Ω·cmto 8×10Ω·cm.


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