The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Mar. 31, 2022
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Ren Xiong, Beijing, CN;
Zhihui Wang, Beijing, CN;
Lei Yang, Beijing, CN;
Xuan Luo, Beijing, CN;
Fengping Wu, Beijing, CN;
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;
BOE TECHNOLOGY GROUP CO., LTD, Beijing, CN;
Abstract
A heat dissipation assembly includes a heat dissipation layer main body including at least one first side, arc-shaped corner side and second side, at least one first bending portion, second bending portion and corner bending portion. A first side, an arc-shaped corner side and a second side are sequentially connected. A first bending portion, a corner bending portion and a second bending portion, that are sequentially connected, are respectively connected to the first side, the arc-shaped corner side and the second side; the corner bending portion is provided with at least one first opening therein. A first opening is in a shape of a strip, and extends substantially in a radial direction of the arc-shaped corner side. In a case where the corner bending portion is provided with first openings therein, the first openings are sequentially arranged at intervals in an extending direction of the arc-shaped corner side.