The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Jun. 29, 2023
Applicant:
Chang Gung University, Taoyuan, TW;
Inventors:
Cher-Ming Tan, Taoyuan, TW;
Hsiao-Chien Chen, Taoyuan, TW;
Assignee:
CHANG GUNG UNIVERSITY, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 21/08 (2006.01); B23P 15/26 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); C25B 11/043 (2021.01); C25D 3/38 (2006.01); C25D 5/54 (2006.01); F28F 3/00 (2006.01); F28F 21/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20481 (2013.01); B23P 15/26 (2013.01); B32B 9/007 (2013.01); B32B 9/041 (2013.01); B32B 15/20 (2013.01); C25D 5/54 (2013.01); F28F 3/00 (2013.01); F28F 21/02 (2013.01); F28F 21/085 (2013.01); B32B 2250/40 (2013.01); B32B 2307/302 (2013.01); C25B 11/043 (2021.01); C25D 3/38 (2013.01); F28F 2255/00 (2013.01);
Abstract
The invention relates to a heat management structure with graphene and copper, and a formation method thereof, comprising a copper foil layer provided, then forming a graphene layer on the copper foil layer surface, and forming an electroplating copper layer on the graphene layer surface, and eventually forming an electroplating copper layer-graphene layer-copper foil layer sandwich heat management structure.