The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Oct. 18, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sangwon Ha, Suwon-si, KR;

Hyunmo Yang, Suwon-si, KR;

Yeonkyung Chung, Suwon-si, KR;

Younoh Chi, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/24 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/113 (2013.01); H05K 3/061 (2013.01); H05K 3/243 (2013.01); H05K 3/421 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09545 (2013.01); H05K 2203/143 (2013.01); H05K 2203/1461 (2013.01);
Abstract

A printed circuit board and/or an electronic device including the same are provided. The printed circuit board and/or an electronic device includes at least one insulation layer including a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed on one surface of the at least one insulation layer to at least partially transverse the flexible region from the first rigid region, and at least one conductive pad formed at least partially on a surface of the first circuit pattern in the first rigid region, wherein the flexible region may be configured to flexibly deform more than the first rigid region.


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