The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Oct. 10, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Arthur J. Higby, Cottekill, NY (US);

David Clifford Long, Wappingers Falls, NY (US);

James Busby, New Paltz, NY (US);

William Santiago-Fernandez, Hopewell Junction, NY (US);

John R. Dangler, Rochester, MN (US);

Russell A. Budd, North Salem, NY (US);

Philipp K Buchling Rego, Wappingers Falls, NY (US);

Hannah Wendling, Poughquag, NY (US);

Lauren Boston, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0275 (2013.01); H05K 1/0292 (2013.01); H05K 1/181 (2013.01); H05K 5/0208 (2013.01); H05K 2201/0909 (2013.01);
Abstract

A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.


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