The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Mar. 30, 2020
Applicant:

Rf360 Singapore Pte. Ltd., Republic Plaza, SG;

Inventors:

Carsten Potratz, Munich, DE;

Peter Selmeier, Maitenbeth, DE;

Thomas Bauer, Munich, DE;

Helmut Klamm, Munich, DE;

Assignee:

RF360 Singapore Pte. Ltd., Republic Plaza, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H03H 9/02834 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01); H04B 1/40 (2013.01);
Abstract

A surface acoustic wave resonator arrangement comprises a piezoelectric substrate () and a surface acoustic wave resonator () which includes an interdigital transducer () disposed on the piezoelectric substrate (). A trench () is disposed within the piezoelectric substrate () facing the resonator (). Trench () causes reflected waves () in response to waves () leaking from the surface acoustic wave resonator. Trench () is configured such that the reflected acoustic waves () achieve phases at the edge () of the resonator () such that the accumulated phases of all the reflected waves received at edge () is zero or substantially zero, thereby avoiding constructive interference of the reflected waves with the acoustic waves resonating in the resonator. Thereby undesired acoustic coupling between resonators or influence of waves reflected at edges of the piezoelectric substrate or dicing lines is reduced.


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