The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Apr. 17, 2020
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Satohiro Kigoshi, Kyoto, JP;

Yuki Tanuma, Kyoto, JP;

Gen Muto, Kyoto, JP;

Minoru Murayama, Kyoto, JP;

Okimoto Kondo, Kyoto, JP;

Chikoto Ikeda, Kyoto, JP;

Yusuke Nakakohara, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/183 (2006.01); H01S 5/0239 (2021.01); H01S 5/042 (2006.01);
U.S. Cl.
CPC ...
H01S 5/04256 (2019.08); H01S 5/0239 (2021.01); H01S 5/183 (2013.01);
Abstract

A semiconductor light emitting device includes a substrate, a common conductive portion formed on the substrate, a semiconductor light emitting element mounted on the common conductive portion, and an electronic component mounted on the common conductive portion and electrically connected to the semiconductor light emitting element by the common conductive portion. This structure shortens the conductive path between the semiconductor light emitting element and the electronic component, thereby reducing capacitance caused by the conductive path between the semiconductor light emitting element and the electronic component. Thus, while reducing parasitic capacitance, the semiconductor light emitting element and the electronic component are electrically connected.


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