The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Sep. 08, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Norihiro Dejima, Yokohama, JP;

Hideaki Takeda, Kawasaki, JP;

Hidenori Matsuo, Hadano, JP;

Masaki Omori, Toshima-ku, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02326 (2021.01); H01S 5/02253 (2021.01); H01S 5/02315 (2021.01); H01S 5/02335 (2021.01); H01S 5/0234 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02326 (2021.01); H01S 5/02253 (2021.01); H01S 5/02315 (2021.01); H01S 5/02335 (2021.01); H01S 5/0234 (2021.01);
Abstract

A laser light source includes: a laser diode chip including an emission layer, a substrate supporting the emission layer, and an emission end surface; a submount that includes a principal surface on which the laser diode chip is fixed and a pair of lens supports located at opposite sides with respect to the emission end surface of the laser diode chip; a lens bonded to the end surfaces of the pair of lens supports; and a semiconductor laser package housing the aforementioned elements. The laser diode chip is fixed to the submount with the emission layer being closer to the submount than is the substrate. The emission end surface of the laser diode chip is located outward with respect to an edge of the principal surface. The end surfaces of the pair of lens supports are located outward with respect to the first end surface of the laser diode chip.


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