The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Jul. 18, 2022
Applicant:

Te Connectivity Solutions Gmbh, Schaffhausen, CH;

Inventors:

Michael Streckewald, Harrisburg, PA (US);

Justin Dennis Pickel, Hummelstown, PA (US);

Julia Anne Lachman, York, PA (US);

Chad William Morgan, Carneys Point, NJ (US);

Assignee:

TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/514 (2006.01); H01R 13/516 (2006.01); H01R 13/6582 (2011.01); H01R 13/6586 (2011.01); H01R 13/6592 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6592 (2013.01); H01R 13/514 (2013.01); H01R 13/516 (2013.01); H01R 13/6582 (2013.01); H01R 13/6586 (2013.01);
Abstract

A wafer assembly includes a leadframe having signal contacts and cables with signal conductors terminated to the corresponding signal contacts. Each cable includes a cable shield providing shielding for the signal conductors. The wafer assembly includes a wafer body holding the signal contacts. The wafer assembly includes first and second ground frames coupled to the first and second sides of the wafer body to provide electrical shielding for the leadframe. The ground frames include ground shields providing shielding for mating ends of the corresponding signal contacts. The ground frames includes cable covers coupled to the corresponding cable shields.


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