The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Sep. 29, 2022
Applicant:
Japan Aviation Electronics Industry, Ltd., Tokyo, JP;
Inventor:
Junji Oosaka, Tokyo, JP;
Assignee:
Japan Aviation Electronics Industry, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/24 (2006.01); H01R 12/57 (2011.01); H01R 12/71 (2011.01); H01R 13/41 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 13/2407 (2013.01); H01R 12/57 (2013.01); H01R 12/716 (2013.01); H01R 13/41 (2013.01); H05K 1/0213 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01);
Abstract
When an upper contact part is not in contact with a signal pad, a lower contact part is not in contact with a short-circuiting pad, and when the upper contact part comes into contact with the signal pad and an elastic deformation part is elastically deformed, the lower contact part comes into contact with the short-circuiting pad. The current path length from the upper contact part to the lower contact part is shorter than the current path length from the upper contact part to a soldering part.