The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Mar. 27, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takashi Ijima, Tokyo, JP;

Koji Yamazaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/28 (2006.01); B23K 20/00 (2006.01); B23K 35/00 (2006.01); B23K 35/30 (2006.01); B23K 103/10 (2006.01); F21V 8/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); B23K 101/30 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 20/008 (2013.01); B23K 35/002 (2013.01); B23K 35/282 (2013.01); B23K 35/3006 (2013.01); G02B 6/0096 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B23K 2101/30 (2018.08); B23K 2103/10 (2018.08); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29564 (2013.01); H01L 2224/29575 (2013.01); H01L 2224/29624 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32502 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/351 (2013.01);
Abstract

Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and an Ag film on an Al substrate serving as a member to be joined, and (B) bringing the Ag films into contact with each other, then (C) heating is performed while pressurizing, and closely adhering and solid-phase joining the Ag films to each other. The completed metal jointed body is a portion where Al—Ag alloy layers are provided on both sides of an Ag—Zn—Al alloy layer to join the Al substrates to each other.


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