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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12412839 B1

PDFFull Text
Date of Patent:
Sep. 09, 2025

Filed:

Feb. 01, 2022

Semiconductor device having an interconnection including plural metal layers, and manufacturing method thereof

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Akira Nakajima, Yokkaichi Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:

Holtz, Holtz & Volek PC

Primary Examiner:

William B Partridge

Assistant Examiner:

Felix B Andrews

Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 21/76805 (2013.01); H01L 21/76846 (2013.01); H01L 21/76895 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01);
Abstract

A semiconductor device according to the present embodiment comprises a first conductive layer. An interconnection is provided above the first conductive layer. A contact is provided between the first conductive layer and the interconnection. The interconnection includes a first metal layer containing hexagonal titanium (Ti) provided above the first conductive layer, a second metal layer containing tantalum (Ta) having a body-centered cubic lattice-like structure and provided on the first metal layer, and a first wiring material provided on the second metal layer.

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Nakajima, Akira. (2025). Semiconductor device having an interconnection including plural metal layers, and manufacturing method thereof (U.S. Patent No. 12412839). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12412839

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