The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Apr. 22, 2022
Applicant:
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Inventors:
Dingyou Zhang, San Jose, CA (US);
Christopher Paul Wade, Los Gatos, CA (US);
Li Sun, San Jose, CA (US);
Chris Chung, San Jose, CA (US);
Assignee:
Avago Technologies International Sales Pte. Limited, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/30 (2013.01); H01L 25/18 (2013.01); H01L 2224/17104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15311 (2013.01);
Abstract
An apparatus includes a first substrate comprising one or more first interconnection layers, wherein a first die is coupled to a first side of the first substrate, and a second substrate comprising one or more second interconnection layers. The second die may be coupled to a first side of the second substrate, and a third die is coupled to a second side of the second substrate. The first substrate and the second substrate may be stacked together.