The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Dec. 10, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Ryo Tsuda, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); B60L 9/00 (2019.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49844 (2013.01); H01L 24/32 (2013.01); B60L 9/00 (2013.01); B60L 2200/26 (2013.01); B60L 2210/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/35121 (2013.01); H02M 1/08 (2013.01); H02M 7/003 (2013.01);
Abstract
An insulated substrate () includes first and second circuit patterns (). A semiconductor device () includes first and second main electrodes () connected to the first and second circuit patterns () respectively and through which main currents flow. A first lead () is solder jointed to the first circuit pattern (). A second lead () is ultrasonic jointed to the second circuit pattern ().