The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Jan. 18, 2022
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Shuhei Onishi, Kyoto, JP;

Takahiro Kitazawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01K 7/02 (2021.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); G01K 7/028 (2013.01); H01L 21/67115 (2013.01);
Abstract

While a wafer having a front surface to which a thermocouple is attached is heated, a temperature of the front surface of the wafer is measured with the thermocouple and a temperature of a back surface thereof is measured with a back surface side radiation thermometer. Emissivity set to the back surface side radiation thermometer is corrected based on the temperature of the wafer measured with the thermocouple. Next, while the semiconductor wafer with a pattern on the front surface is heated, the temperature of the back surface and the temperature of the front surface of the semiconductor wafer are measured with the back surface side radiation thermometer and the front surface side radiation thermometer, respectively. Emissivity set to the front surface side radiation thermometer is corrected based on the temperature of the semiconductor wafer measured with the back surface side radiation thermometer.


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