The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Sep. 17, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Yu Jong Kim, Suwon-si, KR;
Young Do Choi, Suwon-si, KR;
Seung Hee Kim, Suwon-si, KR;
Jong Min Lee, Suwon-si, KR;
Hye Yeon Jeon, Suwon-si, KR;
Tae Ryung Hu, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/022 (2013.01); H01F 27/29 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01);
Abstract
A coil electronic component includes a support substrate having a thickness of 20 to 40 μm. A coil pattern is disposed on at least one of a first surface and a second surface of the support substrate opposing each other, and has an aspect ratio of 4 or higher. An encapsulant encapsulates at least portions of the support substrate and the coil pattern, and an external electrode is disposed in an external region of the encapsulant and connected to the coil pattern.