Pneumatic semiconductor socket lid assembly

Abstract

A socket lid for a semiconductor test socket which uses a plurality of pneumatic cylinders integrated into the socket lid to facilitate the application of a controlled and variable force to multiple zones of an electronic circuit device carried by the test socket. The socket lid includes a cylinder casing with multiple independently sealed pressure chambers, each of which incorporates a plurality a pneumatic cylinders which bear against separate and independently movable compression plates that engage different areas of the electronic circuit device carried by the semiconductor test socket, thus providing an adjustably variable force to multiple zones of the electronic circuit device under test.