The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Dec. 15, 2022
Applicant:

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Chung Woo Lee, Suwon-si, KR;

Tae Dong Park, Hwaseong-si, KR;

Chang Jun Park, Pyeongtaek-si, KR;

Jin Hwan Kim, Hwaseong-si, KR;

Assignee:

SEMES CO., LTD., Cheonan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01); G01B 11/14 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G01B 11/002 (2013.01); G01B 11/14 (2013.01); H01L 21/67259 (2013.01); H01L 21/6831 (2013.01);
Abstract

Proposed are a wafer position detection apparatus and a wafer position detection and correction method using the same. More specifically, proposed is an apparatus for wafer placement teaching for adjusting a position of a wafer disposed on an electrostatic chuck, the apparatus including a laser distance sensor disposed above the electrostatic chuck, and a controller configured to control a robot configured to transfer the wafer. The controller checks a relative position of the electrostatic chuck and the wafer disposed on the electrostatic chuck using the laser distance sensor so that the wafer is transferred to a predetermined position, and teaches the position of the wafer using the checked relative position of the electrostatic chuck and the wafer.


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