The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Feb. 28, 2022
Applicant:
National Institute for Materials Science, Tsukuba, JP;
Inventors:
Akihiro Kikuchi, Tsukuba, JP;
Hitoshi Kitaguchi, Tsukuba, JP;
Yasuo Iijima, Tsukuba, JP;
Kazuto Hirata, Tsukuba, JP;
Assignee:
NATIONAL INSTITUTE FOR MATERIALS SCIENCE, Ibaraki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/16 (2006.01); B21C 37/04 (2006.01); B32B 1/00 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C23C 14/02 (2006.01); C23C 14/30 (2006.01); C23C 14/32 (2006.01); C23C 14/56 (2006.01); C23C 14/58 (2006.01); C23C 16/54 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); H01B 1/02 (2006.01); B21C 1/04 (2006.01);
U.S. Cl.
CPC ...
C23C 14/16 (2013.01); B21C 37/042 (2013.01); B32B 1/00 (2013.01); B32B 15/017 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C23C 14/022 (2013.01); C23C 14/165 (2013.01); C23C 14/30 (2013.01); C23C 14/32 (2013.01); C23C 14/562 (2013.01); C23C 14/5806 (2013.01); C23C 14/5886 (2013.01); C23C 16/545 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/322 (2013.01); C23C 28/345 (2013.01); C23C 30/005 (2013.01); H01B 1/02 (2013.01); H01B 1/023 (2013.01); H01B 1/026 (2013.01); B21C 1/04 (2013.01); C23C 30/00 (2013.01); Y10T 428/1275 (2015.01); Y10T 428/12903 (2015.01);
Abstract
The present disclosure provides a copper-coated aluminum wire material including an aluminum wire material and a copper thin film coating the aluminum wire material that a space factor of the thin copper film is in the range of 0.2% to 4%.