The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Jun. 09, 2023
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Tetsuya Toba, Tokyo, JP;

Yasuaki Kawamura, Tokyo, JP;

Jun Nakagawa, Tokyo, JP;

Shintaro Uemura, Tokyo, JP;

Tomohito Tanaka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/00 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C22C 18/00 (2006.01); C22C 18/04 (2006.01); C23C 2/02 (2006.01); C23C 2/06 (2006.01); C23C 2/12 (2006.01); C23C 2/16 (2006.01); C23C 2/20 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01);
U.S. Cl.
CPC ...
C23C 2/0064 (2022.08); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C23C 2/006 (2013.01); C23C 2/02 (2013.01); C23C 2/022 (2022.08); C23C 2/024 (2022.08); C23C 2/06 (2013.01); C23C 2/12 (2013.01); C23C 2/16 (2013.01); C23C 2/20 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/29 (2022.08); C23C 2/40 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/12757 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/27 (2015.01);
Abstract

A hot-dip plated steel sheet includes a hot-dip plated layer formed on a surface of a steel sheet, the hot-dip plated layer contains 4 to 22 mass % of Al and 1.0 to 10 mass % of Mg with a remainder including Zn and impurities. A pattern portion and a non-pattern portion are formed in the hot-dip plated layer. An element concentrated region containing an element M and an interface alloy layer containing Fe and Al are present at an interface between the steel sheet and the hot-dip plated layer in the pattern portion. An average concentration of the element M contained in the hot-dip plated layer present in the pattern portion and the element concentrated region is 0.0010 to 2 mass %. In the element concentrated region, the element M is concentrated two or more times the hot-dip plated layer present in the pattern portion, or the element M is unevenly distributed.


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