The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Jul. 22, 2021
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Jacob P. Podkaminer, St. Paul, MN (US);

Matthew H. Frey, Cottage Grove, MN (US);

Victor Ho, St. Paul, MN (US);

Matthew T. Johnson, Woodbury, MN (US);

Jeremy K. Larsen, Farmington, MN (US);

Craig W. Lindsay, Arden Hills, MN (US);

Kyle C. Picha, Maplewood, MN (US);

Mario A. Perez, Burnsville, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/00 (2006.01); C08L 33/02 (2006.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
C08K 7/00 (2013.01); C09K 5/14 (2013.01); C08K 2201/001 (2013.01); C08L 33/02 (2013.01);
Abstract

A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.


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