The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Oct. 14, 2019
Ppg Industries Ohio, Inc., Cleveland, OH (US);
Liang Ma, Allison Park, PA (US);
Allison G. Condie, Valencia, PA (US);
Marvin M. Pollum, Jr., Pittsburgh, PA (US);
Lorraine Hsu, Allison Park, PA (US);
Maria S. French, Maidenhead, GB;
Calum H. Munro, Gibsonia, PA (US);
Shuyu Fang, Boise, ID (US);
Masayuki Nakajima, Wexford, PA (US);
PPG Industries Ohio, Inc., Cleveland, OH (US);
Abstract
Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.