The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Sep. 24, 2019
Applicant:
Baker Hughes Holdings Llc, Houston, TX (US);
Inventor:
Marc W. Bird, Houston, TX (US);
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/645 (2006.01); B22F 5/00 (2006.01); B22F 7/06 (2006.01); B23B 27/20 (2006.01); C04B 35/56 (2006.01); C04B 35/63 (2006.01); C04B 35/638 (2006.01); C22C 1/051 (2023.01); C22C 19/00 (2006.01); C22C 19/07 (2006.01); C22C 29/00 (2006.01); C22C 29/08 (2006.01); E21B 10/46 (2006.01); E21B 10/567 (2006.01);
U.S. Cl.
CPC ...
C04B 35/6455 (2013.01); B22F 7/06 (2013.01); B23B 27/20 (2013.01); C04B 35/5626 (2013.01); C04B 35/6303 (2013.01); C04B 35/638 (2013.01); C22C 1/051 (2013.01); C22C 19/007 (2013.01); C22C 19/07 (2013.01); C22C 29/005 (2013.01); C22C 29/08 (2013.01); E21B 10/46 (2013.01); E21B 10/5673 (2013.01); B22F 2005/001 (2013.01); B22F 2998/10 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/402 (2013.01); C04B 2235/404 (2013.01); C04B 2235/405 (2013.01); C04B 2235/427 (2013.01); C04B 2235/604 (2013.01); C04B 2235/85 (2013.01); C04B 2235/9607 (2013.01);
Abstract
A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, Al, W, and C. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.