The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Aug. 08, 2024
Honda Motor Co., Ltd., Tokyo, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A bonding device is used to bond a plate assembly including a first plate and a second plate and includes an anvil, a probe, a shoulder component, a driving mechanism, a power supply, and a control part. The anvil is configured to support a first surface of the plate assembly provided by the first plate. The probe is disposed at a position corresponding to the anvil to be opposite to a second surface of the plate assembly provided by the second plate. The shoulder component is disposed around the probe and has a via for the probe to pass through and an abutting surface for pressing the second surface. The anvil has a hemispherical surface facing the first surface and a receiving surface disposed at a position corresponding to the abutting surface. The anvil contacts the first surface with the hemispherical surface and the receiving surface.