The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Aug. 24, 2021
Applicant:

Sumitomo Electric Hardmetal Corp., Hyogo, JP;

Inventors:

Takashi Harada, Hyogo, JP;

Satoru Kukino, Hyogo, JP;

Naoki Watanobe, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23C 5/00 (2006.01);
U.S. Cl.
CPC ...
B23C 5/00 (2013.01); B23C 2226/125 (2013.01); B23C 2228/49 (2013.01);
Abstract

A cubic boron nitride sintered material tool contains a plurality of cBN grains. cBN grains located on a surface of the cutting edge contain a cubic boron nitride phase, and a hexagonal boron nitride phase. When a ratio I/Ibetween an intensity of a π* peak derived from a π bond of hBN in the hexagonal boron nitride phase and an intensity of a σ* peak derived from a σ bond of hBN in the hexagonal boron nitride phase and a σ bond of cBN in the cubic boron nitride phase is determined by measuring an energy loss associated with excitation of K-shell electrons of boron, the ratio I/Iof the cBN grain on the surface of the cutting edge is 0.1 to 2, and the ratio I/Iof the cBN grain at a depth position of 5 μm from the surface of the cutting edge is 0.001 to 0.1.


Find Patent Forward Citations

Loading…