The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Jul. 20, 2022
Applicant:

Aac Technologies (Nanjing) Co., Ltd., Nanjing, CN;

Inventors:

Bo Zhang, Shenzhen, CN;

Guochuang Huang, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/11 (2006.01); B22F 3/10 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1125 (2013.01); B22F 3/1021 (2013.01); B22F 2003/1131 (2013.01); B22F 2301/10 (2013.01); B22F 2304/058 (2013.01);
Abstract

A preparation method of copper foam includes coating copper paste on a release film to form a coating sheet with a thickness of 50-200 μm on the release film, peeling off the release film to obtain a copper foam preform after drying the release film with the coating sheet, and performing a glue discharging process on the copper foam preform and sintering the copper foam preform to obtain the copper foam having a thickness of 30-120 μm and having a porosity of 50-80%. The thickness of the copper foam is reduced, which ensures a balance between the porosity and a structural strength of the copper foam, so the copper foam has a good water absorption performance, and a heat dissipation performance of the copper foam is effectively improved.


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