The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Aug. 01, 2023
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Donghui Tian, Beijing, CN;

Bo Zhang, Beijing, CN;

Zhiwen Chu, Beijing, CN;

Rong Wang, Beijing, CN;

Yulong Wei, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A display panel having a bonding region for bonding a flexible printed circuit in a peripheral region is provided. The display panel includes a plurality of first signal lines on a base substrate; and a plurality of bonding pins on the base substrate and in the bonding region. The plurality of bonding pins include a plurality of first bonding pins respectively electrically connected to the plurality of first signal lines. The display panel further includes a plurality of connecting portions respectively connecting the plurality of first signal line portions to the plurality of first bonding pin portions. The respective first bonding pin portion includes a first sub-layer, a second sub-layer, and a third sub-layer, stacked together. The respective connecting portion is in a same layer as one of the first sub-layer, a second sub-layer, and a third sub-layer.


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