The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Sep. 06, 2023
Applicant:

Xiamen San'an Optoelectronics Co., Ltd., Xiamen, CN;

Inventors:

Wei-Ping Xiong, Xiamen, CN;

Shu-Fan Yang, Xiamen, CN;

Chun-Yi Wu, Xiamen, CN;

Chaoyu Wu, Xiamen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/84 (2023.01); H01L 21/28 (2006.01); H10H 20/01 (2025.01); H10H 20/80 (2025.01); H10H 20/814 (2025.01); H10H 20/82 (2025.01); H10H 20/825 (2025.01); H10H 20/832 (2025.01); H10H 20/833 (2025.01); H10H 20/85 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H10H 29/142 (2025.01); H01L 21/28 (2013.01); H10H 20/0137 (2025.01); H10H 20/80 (2025.01); H10H 20/814 (2025.01); H10H 20/82 (2025.01); H10H 20/825 (2025.01); H10H 20/833 (2025.01); H10H 20/835 (2025.01); H10H 20/85 (2025.01); H10K 50/84 (2023.02);
Abstract

A flip-chip light emitting diode includes a light-emitting epitaxial laminated layer having a first surface, and a second surface opposing the first surface, and including a first semiconductor layer, an active layer, and a second semiconductor layer, wherein the first surface is a roughened surface; a transparent bonding medium layer over the first surface of the light-emitting epitaxial laminated layer and bonded with a transparent substrate; and a first electrode and a second electrode respectively over a first electrode region and a second electrode region over the second surface of the light-emitting epitaxial laminated layer.


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