The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Nov. 14, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seonghyun Yoo, Seoul, KR;
Yeonga Kim, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a semiconductor device includes forming a light blocking film configured to block first light within a first wavelength band on an edge region of an upper surface of a light-transmitting carrier substrate; forming a photosensitive adhesive layer on the upper surface of the light-transmitting carrier substrate to at least partially cover the light blocking film; bonding a product substrate to the upper surface of the light-transmitting carrier substrate using the photosensitive adhesive layer; partially curing the photosensitive adhesive layer by irradiating the light through the light-transmitting carrier substrate, wherein a portion of the photosensitive adhesive layer overlapping the light blocking film is not cured; processing the product substrate to form a plurality of semiconductor devices after the partially curing of the photosensitive adhesive layer; and cutting the product substrate such that the plurality of semiconductor devices are cut into a plurality of separate individual semiconductor devices.