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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12408356 B1

PDFFull Text
Date of Patent:
Sep. 02, 2025

Filed:

Dec. 24, 2020

Thin film capacitor, its manufacturing method, and electronic circuit substrate having the thin film capacitor

Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Daiki Ishii, Tokyo, JP;

Yoshihiko Yano, Tokyo, JP;

Yuki Yamashita, Tokyo, JP;

Kenichi Yoshida, Tokyo, JP;

Tetsuhiro Takahashi, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:

Rimon P.C.

Primary Examiner:

Nathan Milakovich

Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01G 2/06 (2006.01); H01G 4/005 (2006.01); H01G 4/01 (2006.01); H01G 4/012 (2006.01); H01G 4/06 (2006.01); H01G 4/10 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/252 (2006.01); H01G 4/33 (2006.01); H01L 25/16 (2023.01); H05K 1/18 (2006.01); H10D 1/68 (2025.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H10D 1/696 (2025.01); H01G 2/065 (2013.01); H01G 4/005 (2013.01); H01G 4/008 (2013.01); H01G 4/01 (2013.01); H01G 4/012 (2013.01); H01G 4/06 (2013.01); H01G 4/10 (2013.01); H01G 4/1209 (2013.01); H01G 4/1218 (2013.01); H01G 4/1254 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01L 25/16 (2013.01); H05K 1/18 (2013.01); H10D 1/712 (2025.01); H01G 4/252 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19015 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19103 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member separating the first and second electrode layers. The insulating member has a tapered shape in cross section. With the above configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the insulating member has a tapered shape in cross section, adhesion performance of the insulating member can be enhanced, thus making it possible to prevent short-circuit between the first and second electrode layers.

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