The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Feb. 27, 2023
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Tianzhu Fan, Houston, TX (US);

Yanghe Liu, Ann Arbor, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20254 (2013.01); H05K 1/0272 (2013.01); H05K 7/20927 (2013.01);
Abstract

A highly integrated power electronics embedded PCB-cold plate assembly includes a cold plate, a power electronics embedded printed circuit board (PCB), and a low thermal resistance dielectric layer sandwiched between the cold plate and the power electronics embedded PCB. The power electronics embedded PCB is bonded to the cold plate via the low thermal resistance dielectric layer to form highly integrated power electronics embedded PCB—cold plate assembly is formed. And in one example, the low thermal resistance dielectric layer sandwiched between and directly bonded to the cold plate and the power electronics embedded PCB.


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