The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Aug. 11, 2023
Applicant:

Sandisk Technologies, Inc., Milpitas, CA (US);

Inventors:

Tew Wei Hong, Simpang Ampat, MY;

Chan Tze Ping, Jawi, MY;

Lau Chun Sean, Bayan Lepas, MY;

Heng Junjeen, Hutan Melintang, MY;

Tan Yi Chun, Bayan Lepas, MY;

Wong Guohonn, Bayan Lepas, MY;

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20145 (2013.01); H05K 1/0203 (2013.01); H05K 7/20727 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10545 (2013.01);
Abstract

Thermal management of data storage devices in a server. In one example, a data storage device with a housing includes a first section, a second section, a third section, at least one first aperture that defines an airflow inlet, and at least one second aperture that defines an airflow outlet. A printed circuit board assembly ('PCBA') disposed in the housing includes passive components arranged in a first area corresponding to the second section and active components arranged a second area and a third area corresponding to the first section and the third section, respectively. The airflow inlet and the airflow outlet direct airflow through an airflow channel in the second section of the housing. The airflow channel has a first cross-sectional area between the PCBA and the second section of the housing that is larger than a second cross-sectional area between the PCBA and the first section of the housing.


Find Patent Forward Citations

Wei Hong, Tew. (2025). Thermal management in data storage device (U.S. Patent No. 12408290). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12408290

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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