The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Apr. 08, 2022
Applicant:
Niterra Co., Ltd., Nagoya, JP;
Inventor:
Kensuke Matsuhashi, Nagoya, JP;
Assignee:
NITERRA CO., LTD., Nagoya, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/28 (2013.01); H05K 1/0298 (2013.01); H05K 3/4673 (2013.01);
Abstract
A wiring substrate () includes an insulating substrate (), a surface metal layer provided on a surface of the insulating substrate (), and a wiring layer disposed in an inner part of the insulating substrate (). The surface metal layer (for example, a lead wiring portion ()) is divided by a groove (). The wiring layer (for example, an internal wiring trace ()) is disposed in such a manner that, as viewed from above, the wiring layer detours around a region where the groove () is formed so as not to overlap with the region where the groove () is formed.