The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Aug. 17, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Cheng-Chi Wang, Miao-Li County, TW;

Cheng-Hsien Ho, Miao-Li County, TW;

Kuo-Sheng Yeh, Miao-Li County, TW;

Jui-Jen Yueh, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 1/182 (2013.01); H05K 3/4007 (2013.01);
Abstract

An electronic device includes a first electronic unit, a second electronic unit, a bonding pad, an insulating layer and a circuit layer. The bonding pad is disposed between the first electronic unit and the second electronic unit. The insulating layer is disposed corresponding to the first electronic unit, to the second electronic unit and to the bonding pad. The first electronic unit is electrically connected with the second electronic unit through the circuit layer and through the bonding pad.


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Wang, Cheng-Chi. (2025). Electronic device and method of forming electronic device (U.S. Patent No. 12408269). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12408269

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