The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Sep. 01, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Yasuhiro Kozuka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01); H02M 3/155 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0295 (2013.01); H01L 23/5386 (2013.01); H01L 25/16 (2013.01); H02M 3/155 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A circuit board on which a first set or a second set is exclusively mounted includes an IC attachment part, first and second attachment parts, and first, second, and third conductor patterns. The first set includes a first integrated circuit and a first electric element, and the second set including a second integrated circuit and a second electric element. The first attachment part includes first and second pads, and the second attachment part includes third and fourth pads. In a case where the first electric element is not mounted, the first pad and the second pad of the first attachment part are opened so as not to be electrically conductive with each other. In a case where the second electric element is not mounted, the third pad of the second attachment part and the second pad are opened so as not to be electrically conductive with each other.


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